CODICO IMPULSE 01/2003

HIROSE NEWS: DF23!

The DF23 Series - maintaining a low profile! This connector stacks 2 PCBs or an FPC to a PCB at a sensationally low 1.5 mm.




The height of electronic components ultimately determines the final profile of the finished product.
  In order to keep pace with the market's demand for portable, ultra-light devices, HIROSE has developed a low-profile connector that permits the stacking of two PCBs, or an FPC to a PCB, at a sensational 1.5 mm.

The DF23 series is offered in 10 to 60 pin positions on a mere 0.5mm pitch. During assembly, a reassuring click can be heard when the connector is fully mated.

Due to its flat surface, the DF 23 is ideally suited for pick & place operations. As such, it is supplied in tape & reel packaging. HIROSE also offers optionally available locating bosses and metal fittings (for improved retention).

The headers and sockets are rated at 50V AC and 0.3 amps.

For more detailed information on the DF23 series, please contact

Christian Sichtar, EXT38


CODICO GesmbH & CoKG • Mühlgasse 86-88 • A-2380 Perchtoldsdorf

Tel: +43 1 86 305 • Fax: +43 1 86 305-98 • e-mail: office@codico.com • www.codico.com