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POWER INTERGRATIONS: TOPSwitch™-JX AC/DC power conversion ICs now available in low-profile, thermally efficient, surface-mount package
POWER INTERGRATIONS expanded the successful TOP-Switch™-JX Family by the new SMD-mountable eSOP package. It features an exposed die-attach pad, allowing reflow soldering during PCB assembly. TOP-JX in the slender eSOP package is suited for applications without heatsinks up to 65 W in compact open-frame installations.
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