2010-10-11  AMPHENOL ICC

FCI, a leading developer of connectors and interconnect systems, announces Pwr Profile+™ low profile I/O cable assemblies. Pwr Profile+™ cable assemblies and mating board mount headers are a low profile (8.38mm height) and high current density alternative to existing cable-to-board power connector solutions. Pwr Profile+™ is based on cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from FCI.

"Pwr Profile+™ incorporates an innovative power contact design that permits a more compact, lower profile package for demanding cable-to-board applications," said John Dodds, global power product marketing manager at FCI. "Pwr Profile+™ addresses applications requiring additional power density where a need exists to distribute power via cabling in space-constrained, chassis-based equipment platforms."

Pwr Profile+™ is available with two power contacts (for power and return applications), two signal pins for presence detection or power control and a grounding shield on the board connector for EMC requirements. The grounding shield is optional so it can be omitted if the application does not have EMC concerns.

The signal pins for power control are useful for applications that require current/voltage monitoring and/or feedback regarding battery charge levels (in the case of a battery back-up application). The presence detection feature includes a jumpered signal contact that allows the system to monitor which ports have mated cables and which are empty. If power control or presence detection is not needed, the signal contacts can be omitted.

Pwr Profile+™ is rated to 37A per power contact without exceeding a 30°C temperature rise in still air. The integrated latching system minimizes the connector/cable footprint and the robust housing design includes touch-proof safety features as well as polarization to ensure proper mating.

For more information about Pwr Profile+™, please contact us.


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