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FCI'S HIGH POWER CARD EDGE CONNECTOR PROVIDES LOW POWER LOSS, HIGH LINEAR CURRENT DENSITY

2010-10-11  AMPHENOL FCI

FCI, a leading manufacturer of connectors and interconnect systems, announces the High Power Card Edge (HPCE™) connector. This next generation power card edge connector is intended for applications demanding low power loss and high linear current density. The connector is rated to 9A per power contact beam (with multiple power contacts fully energized) without exceeding a 30°C temperature rise in still air. The HPCE connector has a low profile height (7.50mm) and is based on very cost-effective and highly reliable stamped-and-formed power contact technology.

"The innovative power contact and housing designs deliver a more compact and lower profile package that is ideal for pluggable AC and DC power supplies or board-to-board connections for power distribution," said John Dodds, global power product manager at FCI. "These features make the HPCE™ connector an excellent choice for applications in next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/networking equipment."

HPCE™ connectors are available with power and signal contacts integrated into a single molded housing for power distribution and power control. The flexible, modular tooling approach used for the HPCE connector makes the product highly configurable in terms of the number and placement of the power and signal contacts for custom power needs.

The HPCE™ connector features a low profile height for increased system airflow and heat dissipation, low contact resistance characteristics, significantly increased linear current density, a robust housing with touch-proof safety features and a polarization option to ensure proper mating. Vertical and right-angle options are available to accommodate various system architectures.

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