C6490 Development Kit
1.310,00 €
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Development kit for the C6490 SOM, based on Qualcomm's 6nm QCS-6490 SoC a long life, highly integrated and and powerful AI processor for IIOT
Produktcode:
308572
Gewicht: 1000 g
Hersteller: THUNDERCOMM
Gewicht: 1000 g
Hersteller: THUNDERCOMM
Detailinfos
Qualcomm QCS6490 Qualcomm Kryo CPU 670
Qualcomm Adreno GPU 642L, Adreno 633 VPU, Adreno DPU 1075
Qualcomm Compute Hexagon DSP with dual HVX, Hexagon Co-processor
(Hexagon CP) 2.0 and Hexagon Tensor Accelerator Qualcomm Spectra
12.5 TOP capable of hosting Qualcomm and 3rd party LLM / LVM models
570L image processing
SOM Memory configuration Memory 6GB+128GB or 8GB+128GB
Connectivity 802.11 ax over PCIe with DBS, 2x2 MIMO (Wi-Fi 6E), Bluetooth 5.2
Video Encode 4K at 30FPS for H.264/H.265
Video Decode 4K at 30FPS for H.264/H.265/VP9
1x MIPI-DSI 4-lane
FHD+ (1080x2520) 8L at 144FPS
4K at 60FPS display support over DisplayPort
5 x 4-lane MIPI CSI D-PHY
(2 of them compatible with 3-trio MIPI CSI C-PHY up to 48M camera)
Peripherals 1 x USB 3.1 with DP, 1 x USB2.0, 1 x PCIe Gen3 2-lane, 2 x SoundWire, 1 x SDC
for SD card, 3 x DMIC Interfaces, GPIOs, QUPs (UART/I2C/SPI)
SOM Form Factor LGA, dimensions 42.5mm x 35.5mm x 2.7mm
OS Android 13(A14, A15, A16 in future) and Ubuntu
Qualcomm Adreno GPU 642L, Adreno 633 VPU, Adreno DPU 1075
Qualcomm Compute Hexagon DSP with dual HVX, Hexagon Co-processor
(Hexagon CP) 2.0 and Hexagon Tensor Accelerator Qualcomm Spectra
12.5 TOP capable of hosting Qualcomm and 3rd party LLM / LVM models
570L image processing
SOM Memory configuration Memory 6GB+128GB or 8GB+128GB
Connectivity 802.11 ax over PCIe with DBS, 2x2 MIMO (Wi-Fi 6E), Bluetooth 5.2
Video Encode 4K at 30FPS for H.264/H.265
Video Decode 4K at 30FPS for H.264/H.265/VP9
1x MIPI-DSI 4-lane
FHD+ (1080x2520) 8L at 144FPS
4K at 60FPS display support over DisplayPort
5 x 4-lane MIPI CSI D-PHY
(2 of them compatible with 3-trio MIPI CSI C-PHY up to 48M camera)
Peripherals 1 x USB 3.1 with DP, 1 x USB2.0, 1 x PCIe Gen3 2-lane, 2 x SoundWire, 1 x SDC
for SD card, 3 x DMIC Interfaces, GPIOs, QUPs (UART/I2C/SPI)
SOM Form Factor LGA, dimensions 42.5mm x 35.5mm x 2.7mm
OS Android 13(A14, A15, A16 in future) and Ubuntu
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Hersteller: THUNDERCOMM
