WLE7002E26

Module Supplier: Compex
Chip Supplier: Qualcomm
Chip Part Number: QCN-6274-0
Interface Wi-Fi: PCIe 3.0, miniPCIe
Interface Bluetooth: NA
Linux & Android / Mainline Driver: yes / from 5.4.213 upwards
Windows: NA
Bluetooth Standard: NA
WiFi Standard: WiFi 7
MIMO: [MU 2x2 + 2x2, DBS]
Frequency: 2.4 GHz & 6 GHz
Bandwidth: HT320
Antenna Data Rate: 688 Mbps + 5765 Mbps
Antenna Configuration: [2G,6G] + [2G,6G]
Antenna Type: 2 x U.FL
Monitor Mode: yes
Full AP / Soft AP: yes / yes
Power Supply: 3.3V
Dimension (mm): 30 x 50.8 x 20.3
Package: miniPCIe
Temperature Range: -20°C to 70°C