New LTE-Advanced CAT 6 Modules by QUECTEL
Three Types for LTE-A Modules
QUECTEL's LTE portfolio further expands, by releasing for the first time new LTE-A CAT 6 modules - QUALCOMM based. Adopting the 3GPP Rel. 12 LTE technology and thanks to Carrier Aggregation this new family can reach a data rate of 300Mbit/s in downlink and 50Mbit/s in uplink.
EG06, EP06 and EM06 from QUECTEL each represent the same product developed in 3 different form factors in order to address a wide range of usage.
EG06 is designed in LGA form factor with a size of 39.5×37.0×2.8mm, EP06 comes in Mini PCIe and EM06 is the first QUECTEL module in M.2 form factor.
Pin to Pin Compatible With Higher Data Rate Modules
The 3 form factors, but especially the LGA, will be the base for a rich future roadmap of other LTE-A modules. In fact, the 3 modules will be pin to pin compatible with higher data rate LTE CAT 9, CAT12, CAT16 modules, which will facilitate customers to migrate between different categories and update their devices with higher speed technologies, required by the market.
They support the cellular standards LTE-A and UMTS/HSPA+, but for the first time GSM/GPRS is not included.
Quick Specs:
- Multi-mode LTE CAT 6 / UMTS/HSPA+
- Different variants available: EMEA/Australia/Brazil, America, Latin America, Asia Pacific
- Multi-Constellation GNSS Receiver
- Interfaces: USB 2.0/3.0, Ethernet (LGA only), PCIe gen2, PCM, GPIO, 3x UART, SD, ADC, SPI, I2C
- Enhanced features: MIMO, eCall, BT 4.0, VoLTE, DTMF, DFOTA
- Industrial temperature range -40°C to +85°C (LGA only)
Your Contact Person
For more details, please contact Joachim Strohschenk.
