News
Qualcomm RB3 Gen2 Development
The Qualcomm® RB3 Gen 2 development kit from Qualcomm Technologies, Inc. is based on a highly integrated and powerful AI processor.
QUALCOMMRUBYCON: New ZLR Series Featuring Extremely Low ESR Values
RUBYCON has already pioneered water-based electrolytic capacitors and is now setting new standards.
RUBYCONCODICO is "Distributor of the Year 2024"
We are delighted to announce that we have been awarded multiple prizes in the "Distributor of the Year 2024" readers' choice.
Optimal Cooling in EV Charging Stations by STK Fan
The advanced cooling technology of fans from STK Fan support reliable charging stations.
STK FanIEEE802.3bt Class 6 (50W) Compliant Module by SILVERTEL
Ag59612-LPB and Ag59624-LPB from SILVERTEL are IEEE802.3bt Class 6 compliant PD modules.
SILVERTELCOMPEX Introduces New Wi-Fi7 DBS Modules
The new Wi-Fi7 modules WLE7002E25D and WLT7002E25D-E from COMPEX are based on the QCN6224 and QCN9274-I radio chipsets from QUALCOMM.
COMPEXProgrammable 45V/3A Step-Down-Module by MPS
The MPM3593 is a high-frequency, synchronous, rectified step-down module with an I2C control interface.
MPSNEXTRON’s High Current Connectors for High Power
NEXTRON's high-current connectors facilitate efficient energy transfer in compact spaces.
NEXTRONAEVF400 Series for High Voltage DC Switching Applications
The AEVF400 DC high power contactors offer unparalleled reliability.
ALTRAN MAGNETICSZL Series: Unparalleled Capacitance for Miniaturised Designs
The ZL series offers the highest capacitance in the industry, surpassing competitor products by up to 170%.
PANASONICDurable 7.0" Display for Demanding Conditions by YEEBO
YEEBO is expanding its portfolio with a 7.0" display that is ideal for outdoor applications.
YEEBONew AI-Based Embedded Computing Platform Astra
SYNAPTICS recently unveiled the "AI-native" embedded computing platform Astra – specifically designed for edge applications.
SYNAPTICSXC928x Series: Synchronous Step-Down DC/DC Converters
The XC928x series features step-down DC/DC converters with integrated P-channel and N-channel FETs.
TOREXQCC740: New Tri-Radio Chipsets
Unlike conventional tri-radio combination chipsets on the market, the new QCC740 family is offered with a wide range of on-chip features.
QUALCOMMMPS: Automotive Dual-LDO With Pre-Boost and I²C-Interface
This LDO features a boost pre-regulator that operates at either 400kHz or 2.2MHz.
MPSRUBYCON’s New Series: Increased Capacity
RUBYCON has introduced its new MXZ series, boasting about 10% more capacity compared to the currently smallest MXT series on the market.
RUBYCONHIROSE´s Connectors for Safe Energy Transmission at Home
HIROSE’s DF6x series offer compact connectors with high performance and current-carrying capacity.
HIROSEBSS Series: Integrated Current and Temperature Measurement
The BSS series combines a shunt and a circuit board, which enables direct voltage measurement.
ISABELLENHÜTTEWi-Fi7 Modules for the Next Generation of Connectivity
QUECTEL Wireless Solutions introduces FGE576Q and FGE573Q, the first Wi-Fi7 modules in its portfolio.
QUECTELUp to 88% Energy Savings: IoT Wi-Fi4 SoC QCC-730
The IoT Wi-Fi4 SoC QCC-730 from QUALCOMM achieves power savings of up to 88% compared to earlier in-house IoT products.
QUALCOMM