News
Automotive Certified Ultra-Small Current Sensor MCQ1823
MCQ1823 from MPS is an linear Hall-effect current sensor IC for suitable both AC and DC current sensing.
MPS
GaN Technology by EOS on an Industrial-Standard Footprint
The standout improvement is its increased efficiency, resulting in vastly improved thermal performance.
EOS
RG255G – New 5G Redcap Module for Industrial Use
QUECTEL's RG255G series utilises 3GPP Rel-17 RedCap technology with URLLC/Slicing up to 256QAM DL/UL.
QUECTEL
New PSE-Modul on "Golden Blocks" by SILVERTEL
SILVERTEL has expanded its product range with its first PSE IEEE802.3bt module on "Golden Blocks."
SILVERTEL
XC9702 Series: Efficient Voltage Conversion
The XC9702 series enables the development of extremely compact solutions that can operate in ambient temperatures (-40°C to 125°C).
TOREX
EPR Series: Advancing PCB Relays With MOS Technology
Utilising MOSFETs for output, these relays are ideally suited for the switching of small analogue signals.
GOODSKY
DINKLE 0156 & 0159: Advanced Push-In Terminals
The rapid pace of 5G is opening up new horizons for industry and the IoT. DINKLE offers reliable solutions.
DINKLE
Photo Gallery: embedded world 2024
Did you take part in CODICO's game? You can find the winner photos in our gallery. Thank you for your visit of our booth at embedded world!
Reliable PCB Connections: BrightConnX FLT Terminal
AMPHENOL CS provides simple, secure push-in connections compatible with a range of wire gauges suited for pick and place.
AMPHENOL CS
ZV Series: Compact High-Current Hybrid Capacitors
PANASONIC Industry introduced the new ZV series consisting of polymer hybrid aluminum electrolytic capacitors to the market.
PANASONIC
Extensive Ethernet Connectivity by EATON
The EATON LANxV family is a comprehensive solution that combines a LAN transformer and a common mode choke into a single module.
EATON ELECTRONICS
AX99100A - New Generation PCIe to Multi I/O Controller
AX99100A provides a cost-effective PCIe to multiple serial/parallel ports & I/O bridge controller solution.
ASIX
First 5G RedCap Module by TELIT CINTERION
TELIT CINTERION announced the first-generation RedCap modules enabled by Snapdragon X35 5G modem-RF system.
TELIT CINTERION
AMPAK's New Triple Combo Module With Wi-Fi6/6E
AMPAK TECHNOLOGIES released the AP6611S - a Wi-Fi6E and Bluetooth5.3 combo SoC tailored for IoT products.
AMPAK TECHNOLOGY
Half-Bridge-Driver With Two GaN FETs by INNOSCIENCE
INNOSCIENCE introduces the ISG3201, a space-efficient solution boasting remarkable power.
INNOSCIENCE
Integrated Battery Management Evaluation Board by MPS
MBMxxS-P100-x represents a solution for high-current designs housing a 7-16 cell battery management unit.
MPS
QUALCOMM’s QCC-711: Bluetooth Low Energy v5.4 SoC
A unique tri-core BLE SoC architecture leveraging a license free open software development environment.
QUALCOMM
Miniaturisation: KDS Introduces the DST310SA
DST310SA by KDS represents an innovative 32,768kHz unit packaged in a 3.2x1.5mm housing and utilises the same crystal blank as the DST1610A.
KDS Daishinku Corp
HIROSE HR34P: Connectors for Blind-Mate Panel Mounting
The HR34P series effectively addresses the requirements of AGVs and AMRs.
HIROSE
New EMI Suppression Film Caps for Harsh Conditions
KEMET has expanded its diversity of EMI suppression capacitors, with a specific emphasis on THB versions designed for challenging conditions and high voltages.
KEMET